Electronic circuits for product packaging and game pieces

ABSTRACT

Product packages and methods of making same, and unpowered conductive circuits for use, for example, as game pieces and methods of making the same. The product package includes a paperboard blank configured to be formed into a box. An electrical circuit is printed with conductive ink pattern onto a surface of the blank. A user may interact with the electrical circuit by, for example, pressing tabs cut into the box. The tabs may include conductive contacts that activate sections of the electrical circuit, thereby producing one or more desirable effects in response to various combinations of tabs being pressed by the user. The electrical circuit may be powered by a battery inserted into a battery compartment of the product package. The blank may include a removable section with a printed electrical circuit, or a portion thereof, that may be separated from the blank and used separately from the product package.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of Provisional ApplicationNo. 61/822,613, filed May 13, 2013, and Provisional Application No.61/753,253, filed Jan. 16, 2013, which are each hereby incorporated byreference herein in its entirety.

BACKGROUND

The invention relates generally to packaging for consumer products thatincorporates electrical circuitry and, more particularly, to paperboardboxes that include electrical circuitry that is integrated with the box,and methods of making the same, as well as unpowered conductive circuitsfor use, for example, as game pieces and methods of making the same.

Point-of-sale product marketing is a highly competitive process. Whenshopping for consumer goods in a retail environment, consumers oftenmake choices based largely on the appearance of the product packaging.Customers of commodities, such as breakfast cereals, tend to beespecially receptive to being influenced by product packaging. Inparticular, children may be attracted to products that are packaged ininteresting ways, or that include a stimulating toy or prize, and mayattempt to persuade their parents to buy the product based primarily onthe appearance of the product package or the inclusion of the toy in theproduct package. Consequently, there is a need for cost-effective, new,and improved product packages that entice customers to buy the product,and methods for making these cost-effective, new, and improved productpackages.

SUMMARY

In one embodiment, a product package includes a paperboard blank havinga surface and a conductive ink pattern printed on the surface of thepaperboard blank. The blank is configured to define the product package(e.g., upon uprighting or erecting). The conductive ink pattern definesat least part of an electrical circuit that is integrated with theproduct package.

In another embodiment, a method of making a product package includesprinting a conductive pattern on a surface of a paperboard blank. Theconductive ink pattern defines at least part of an electrical circuitthat is integrated with the product package.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated in and constitute apart of this specification, illustrate various embodiments of theinvention and, together with the general description of the inventiongiven above, and the detailed description of the embodiments givenbelow, serve to explain the principles of the invention.

FIG. 1 is a diagrammatic view of an exemplary game application.

FIG. 2 is a schematic view of a circuit that implements the gameapplication of FIG. 1.

FIG. 3 is a top view of a blank of packaging material configured to beformed into a box that includes a printed conductive ink pattern whichdefines a lower level of printed electrical circuitry for implementingthe circuit of FIG. 2.

FIG. 4 is a top view of the blank of FIG. 3 illustrating a dielectriclayer pattern for isolating the lower level of printed electricalcircuitry from an upper level of printed electrical circuitry.

FIG. 5 is a top view of the blank of FIG. 4 that includes a printedconductive ink pattern that defines the upper level of printedelectrical circuitry.

FIG. 6 is a top view of the blank of FIG. 5 illustrating a dielectricover-layer pattern for protecting the underlying electrical circuitry.

FIG. 7 is a top view of the blank of FIG. 6 illustrating the layersdefined in FIGS. 3-6.

FIG. 8 is a cross-sectional view of a multi-level portion of a printedcircuit showing a vertical structure for the conducting and insulatinglayers.

FIG. 9 is a top view of a blank of packaging material configured to beformed into a box that includes a printed conductive ink pattern whichdefines a lower level of printed electrical circuitry for an alternativeimplementation of the circuit in FIG. 3.

FIGS. 10 and 11 are diagrammatic views showing additional detail ofcontact pads comprising a switch of the circuitry in FIG. 2 inaccordance with embodiments of the invention.

FIG. 12 is a top view of the blank of FIG. 9 illustrating a dielectriclayer pattern for isolating the lower level of printed electricalcircuitry from an upper level of printed electrical circuitry.

FIG. 13 is a top view of the blank of FIG. 12 that includes a printedconductive ink pattern that defines the upper level of printedelectrical circuitry.

FIG. 14 is a top view of the blank of FIG. 13 illustrating a dielectricover-layer pattern for protecting the underlying electrical circuitry.

FIG. 15 is a top view of the blank of FIG. 14 illustrating the layersdefined in FIGS. 9 and 12-14.

FIG. 16 is diagrammatic view of a side of a box formed from the blank inFIG. 7 showing tabs and a cavity configured to receive a battery.

FIG. 17 is diagrammatic view of the side of the box in FIG. 16 showingthe tabs in a folded position.

FIG. 18 is a perspective view of a product package in the form of acereal box.

FIG. 19 is diagrammatic view of an image that may be printed on a sideof the box in FIG. 18 consistent with an embodiment of the invention.

FIG. 20 is a schematic view of a circuit that implements an electronicfeature on a package.

FIG. 21 is a top view of a blank of packaging material configured to beformed into a box that includes a printed conductive ink pattern whichdefines a level of printed electrical circuitry for the circuit in FIG.20.

FIG. 22 is a top view of the blank of FIG. 21 illustrating a dielectricover-layer pattern for protecting the underlying electrical circuitry.

FIG. 23 is a top view of the blank of FIG. 22 illustrating the layersdefined in FIGS. 21 and 22.

FIG. 24 is diagrammatic view of an image that may be printed on a sideof a box formed from the blank in FIG. 23 consistent with an alternativeembodiment of the invention.

FIG. 25 is a schematic view of a circuit in accordance with analternative embodiment of the invention.

FIG. 26 is a top view of a blank of packaging material configured to beformed into a box that includes a printed conductive ink pattern whichdefines a lower level of printed electrical circuitry for the circuit inFIG. 25.

FIG. 27A includes a top view of a section of the blank in FIG. 26 thatmay be formed into a game piece for use with a touch sensitive device,and a perspective view of the assembled game piece.

FIG. 27B is a top view of the section of the blank in FIG. 27A includinga printed image.

FIG. 27C is a perspective view of the game piece of FIG. 27B.

FIG. 27D is a perspective view of a section of the blank in accordancewith an alternative embodiment in which the contact pads have beenembossed to provide raised contact surfaces.

FIG. 27E is a cross-sectional view taken generally along line 27E-27E inFIG. 27D.

FIG. 28 is a top view of the blank of FIG. 26 illustrating a dielectriclayer pattern for isolating the lower level of printed electricalcircuitry from an upper level of printed electrical circuitry.

FIG. 29 is a top view of the blank of FIG. 28 that includes a printedconductive ink pattern that defines the upper level of printedelectrical circuitry.

FIG. 30 is a top view of the blank of FIG. 29 illustrating a dielectricover-layer pattern for protecting the underlying electrical circuitry.

FIG. 31 is a top view of the blank of FIG. 30 illustrating the layersdefined in FIGS. 26, and 28-30.

FIG. 32 is a top view of a game that may be printed on the blank in FIG.31.

FIG. 33 is a perspective view of the game in FIG. 32 showing a useractivating a switch with a game stylus.

FIG. 34 is a top view of a game in accordance with an alternativeembodiment of the invention.

FIG. 35 is a perspective view of the game in FIG. 34 showing a useractivating a switch with a game stylus.

DETAILED DESCRIPTION

Embodiments of the invention are directed primarily to product packagingthat incorporates printed electrical circuitry applied to one or moreinterior or exterior surfaces of the package. The printed electricalcircuitry may be configured to provide the consumer with a variety ofapplications, such as a game or other sensory stimulating apparatus. Tothis end, applications provided by embodiments of the invention mayprovide a plurality of sensory stimulations, such as light and sound.

For example, the product package may be a cereal box configured toprovide an interactive game or other electronic entertainment once thegoods have been removed from the product package. The product packagemay also be configured so that the electrical circuit draws attention tothe product or otherwise enhances the appeal of the product whendisplayed in a retail environment. To this end, embodiments of theinvention may include a variety of printed electrical circuits andelectrical components, including lines, switches, and terminals. Thesecircuits may be operatively coupled with light-emitting diodes, powersources, programmable chips, audio transducers, and electronic displaysto provide a desired application or effect. Power sources may include aninternal power source (e.g., a battery integrated into the productpackage) or an external power source (e.g., an alkaline battery that iscoupled to the product package externally and/or provided by the user).

The printed electrical circuitry may be printed either directly on asurface of the product package, or on a secondary carrier substrate,such as a flexible film, that can then be attached to the productpackage. The inks used to print the circuitry may include any suitableprintable material, such as metallic (e.g., silver) ink, conductivecarbon ink, silver chloride ink, or any other suitable ink. In addition,dielectric ink, such as an acrylic, may be deposited over a lower layerof conductive ink so that another layer of conductive ink may bedeposited over the lower conductive ink layer to form electricalcircuits having multiple layers. Additional dielectric layers may beprinted between the conductive layers to increase the isolation betweenthe conductive layers. These additional dielectric layers may includelayers having dissimilar materials. The conductive ink may be printed onthe product package material using a conventional printing technique,such as screen print, flexo, gravure, photo-pattern, pad printing, andjet printing to form traces and other components of the printedelectrical circuitry. Carriers for the ink (known as film formers) maybe based on acrylics, urethanes, water, latex, and/or any other suitablecarrier.

The ink may typically comprise carbon in a water-based carrier so thatthe resulting product satisfies the Coalition of Northeastern Governors(CONEG) model legislation regarding allowable levels of heavy metals insolid municipal waste. These materials may also prevent contamination offood products contained in the product package, and may contribute tobio-degradable and/or recyclable features of the package. Theapplication of sustainable environmental stewardship in therecyclability of the package and printed circuits sharply contrasts withnormal printed circuits that include metallic content.

After the traces defining the electrical circuit are printed on a blankcomprised of a packaging material, the blank may be cut to defineopenings for discrete electronic components, e.g., light emitting diodes(LEDs), battery contact pads, or other features of the desiredapplication. The discrete electronic components may be coupled to thetraces using a suitable conductive material, such as a conductive tape(e.g., copper tape) or a conductive adhesive (e.g., a conductive epoxy).In an embodiment of the invention, holes may be cut in the packagingmaterial so that the product package is configured to receive LEDs,which may be coupled to traces printed on an interior surface of theproduct package. The openings may allow the LEDs to be visible fromoutside of the product package. In an alternative embodiment, the LEDsmay be attached to an outside surface of the package, in which case theholes for the LEDs may be omitted. The packaging material may also becut to define a receptacle configured to receive a battery, such as a9-volt battery, for powering the electrical circuitry. Further cuts maydefine detachable game components configured to interact with a gameboard portion of the box, or other external devices such as a touchscreen of a tablet computer or smart phone. Embodiments of the inventionmay also include other electrical circuits, such as a processor, thatare coupled to the traces. These additional circuits may be coupled tothe interior surface of the product package so that they are not visiblefrom the exterior of the product package. Embodiments of the inventionmay thereby bring added value in a post-use application to consumerproduct package at a reasonable cost.

Referring now to FIG. 1, an exemplary embodiment of the productpackaging provides an electronic version of a “rock-paper-scissors” game10. In rock-paper-scissors, each of two players simultaneously indicatesthe selection of one of a rock 12, a sheet of paper 14, or a pair ofscissors 16 with a respective hand gesture 18, 20, 22. If one of theplayers selects a rock and the other paper, the player selecting paperwins. If one of the players selects paper and the other scissors, theplayer selecting scissors wins. If one of the players selects scissorsand the other rock, the player selecting rock wins. If both playersselect the same object, the game is a push, and there is no winner.

The embodiments of the invention are not limited to the“rock-paper-scissors” game 10. Generally, other types of multi-player orsingle player games may be provided by the inventive product packagingand printed electrical circuitry. The games may possess educationalvalue appropriate for a self-guided teaching session, may be gearedtoward amusement purposes, or a combination of these objectives.

FIG. 2 illustrates a circuit 30 for implementing the electronic versionof rock-paper-scissors of FIG. 1. The circuit 30 includes LEDs 38, 40and a plurality of double-pole switches 32-37 that selectively coupleLEDs 38, 40 to a power source 42 (e.g., a battery). The power source maybe coupled to the circuit 30 through a resistor 44 to control the amountof current that flows through the LEDs 38, 40. The switches 32-37 arecoupled by conductive traces 46 so that the switches 32-37 define alogic circuit that illuminates an appropriate LED 38, 40 in response tothe game players each activating one pair of the switches 32-37. In anembodiment of the invention, switches 32 and 37 are labeled asrepresenting scissors, switches 33 and 35 are labeled as representingpaper, and switches 34 and 36 are labeled as representing rock.

To play the game, one player (player “A”) activates one of switches32-34, and another player (player “B”) activates one of switches 35-37.If both players activate switches representing the same type of object,a circuit is not completed through either of the LEDs 38, 40, andneither of the LEDs is illuminated (or optionally both LEDs 38, 40 canbe simultaneously illuminated). If player A activates switch 32(scissors) and player B activates switch 35 (paper), a circuit iscompleted that couples LED 38 to power source 42. In response to beingconnected to power source 42, LED 38 illuminates, indicating player A isthe winner. If player A activates switch 32 (scissors) and player Bactivates switch 36 (rock), a circuit is completed that couples LED 40to power source 42. In response to being connected to power source 42,LED 40 illuminates, indicating player B is the winner. In a similarmanner, if player A activates switch 33 (paper) and player B activatesswitch 36 (rock), LED 38 illuminates indicating player A is the winner.If player A activates switch 33 (paper) and player B activates switch 37(scissors), LED 40 is illuminated indicating player B is the winner. Ifplayer A activates switch 34 (rock) and player B activates switch 37(scissors), LED 38 is illuminated indicating player A is the winner.Finally, if player A activates switch 34 (rock) and player B activatesswitch 35 (paper), LED 40 is illuminated indicating player B is thewinner.

LEDs 38, 40 represent one type of discrete electronic component that canbe integrated into the circuit 30. Other types of discrete electroniccomponents, such as sound chips and memory chips, may also be integratedinto the circuit 30. The discrete electronic components may be coupledto the traces using a suitable conductive material, such as a conductivetape (e.g., copper tape) or a conductive adhesive (e.g., a conductiveepoxy). Alternatively, the electronic component may be mounted to athin, flexible board (e.g., an FR-4 printed circuit board), whichincludes conductive material (e.g., amounts of the conductive ink)applied at the contact points with the traces of the circuit 30. Theboard (and the attached electronic component) may be positioned in apick-and-place operation, and then the board may be adhesively bonded(e.g., tacked) to the paperboard blank using, for example, a hot meltadhesive.

Referring now to FIGS. 3-7, in an embodiment of the invention, thecircuit 30 may be implemented on a substrate or blank 50 of packagingmaterial having a surface 51. The blank 50 may be comprised of asubstrate of a cellulose-based material commonly referred to aspaperboard or cardboard, which has a thickness (e.g., 0.022 inches)suitable for a product package. The blank 50 may include score or foldlines 52 and cut lines 54 configured so that the blank 50 may be formedinto a carton or box, such as a cereal box 200, 230 (FIGS. 16-18),having one or more tabs 56 and openings 57.

As best shown in FIG. 3, a conductive ink pattern 58 may be deposited onthe surface 51 of the blank 50, which may correspond to an interiorsurface of the product package, to form a printed circuit. Theconductive ink pattern may be comprised of a plurality of traces 62printed on the surface 51, with each trace 62 having a width W, a lengthL, and a thickness T (FIG. 8). The traces 62 may be configured so thatthere are gaps 63 between exposed sections, or contact pads 65 ofselected traces 62 that comprise the double-pole switches 32-37, as willbe described in more detail below. Selected traces 62 may also includeregions that provide contact pads 65 configured to interact with othersections of the conductive ink pattern 58 and/or external circuitcomponents, such the power source 42. For example, contact pads 65 a and65 b (FIG. 5) may be configured to engage terminals of a battery.

The conductive ink pattern 58 may be printed the front side of the blank50, the back side of the blank 50, or both sides of the blank 50. Theconductive ink pattern 58 may appear on the inside of the package, theoutside of the package, or on both sides of the package after the blank50 is uprighted or erected to form the package.

The width W, length L, and thickness T of the traces 62 may becontrolled by adjusting the amount of ink, and the pattern in which theink is applied to the surface 51. By adjusting the dimensions of thetraces 62, the resistances of the circuit 30 may be controlled. In oneembodiment, the resistor 44 of circuit 30 may be provided by theresistance of the traces 62 so that the need for a discrete electricalcomponent is negated. In addition, the width W and/or thickness T ofeach trace 62 may be adjusted independently of the other to balanceresistances between different sections of the conductive ink pattern 58and/or to compensate for varying lengths L of the traces 62. The tracethickness may be measured relative to the plane of the surface 51 onwhich the traces 62 are printed.

The fold lines 52 and cut lines 54 may be configured so that the blank50 can be formed into a box suitable for containing a consumer product,such as a breakfast cereal. Additional fold lines 52 and cut lines 54may also be included in the blank 50 to define features of the productpackage that facilitate operation of the circuit 30. For example, thefold lines 52 and cut lines 54 may be configured in a pattern 67configured to define a battery cavity or compartment 204 (FIG. 16) inthe finished product package 200 (FIG. 16). Electrical power may besupplied from a battery held in the battery compartment 204 to a printedcircuit configuration on the top side, the back side, or both sides ofthe blank 50 which allows, in certain embodiments, for the mounting ofdevices or the implementation of circuitry inside, outside, or both(i.e., on the interior and/or the exterior) of a package formed from thefolded and uprighted blank 50.

The carton formed from the blank 50 defines a three-dimensional platformcharacterized by a height, a width, and a depth with folding about thescores (e.g., fold lines 52) for erection/set-up. On the platform, amyriad of end-use applications are achievable through design andplacement of a customized circuit configuration.

The integrity of the printed circuit defined by the conductive inkpattern 58 may be maintained regardless of whether the surface 51 is theback side (which is porous) of the substrate selected as the blank 50 orthe top side of the selected substrate (which may be less porous thanthe backside) when the printed circuit is flexed over structural scorelines 52. The ability to maintain the integrity may depend, among otherfactors, upon the width-to-thickness aspect ratio of the traces 62.

It has been observed that, if the thickness T of the traces 62 isgreater than a few microns, the traces 62 tend to fracture (i.e., crack)and/or flake off in areas where the traces 62 cross score or fold lines52 when the blank 50 is folded (e.g., folding by 90° at the fold line52). It has also been determined that traces 62 having an insufficientthickness T tend to be unreliable conductors when printed on interiorsurfaces of paperboard blanks 50. This unreliability may be due, atleast in part, to the roughness of the interior surfaces of thepaperboard blanks 50 typically used in product packaging. Theseconflicting requirements for fabricating traces 62 with conductive inkhave discouraged persons having ordinary skill in the art of packageengineering from using conductive ink to form circuits on cardboardblanks. However, it has been discovered that by increasing the width Wof the traces 62 so that the traces have a large width-to-thicknessaspect ratio, printed conductive ink traces may be formed that providereliable circuits on interior surfaces of folded cardboard blanks 50.The resistance of the traces is proportional to the length, width andheight of the traces 62, in addition to the resistivity of the materialcomprising the conductive ink. Depending on the appropriate printtechnique and circuit configuration different dimensioningspecifications are applied. For example, in an embodiment of theinvention, a gravure plate may have an etch effect described as BCM(billion cubic microns) and, in this application, may reach a 100Billion Cubic Microns (BCM) of ink per cm² in the gravure pattern incombination with a trace width W of between 0.375 and 0.750 inches. Inanother embodiment of the invention, rotogravure printing may use a 60Lines per Inch (LPI) screen and a volume application for the conductiveink of 60 Billion Cubic Micron (BCM) to provide a sheet resistance valueof about 100 ohms per square. Circuit resistors, such as resistor 44,may be integrated into the conductive ink pattern 58 by adjusting thewidth (i.e., the resistance) of the traces 62.

Moreover, by adjusting the width of the traces 62, the resistance of thetraces 62 may be adjusted to a desired level, and circuit resistancesmay be balanced while maintaining an optimum trace thickness T to resistcracking. The LEDs 38, 40 may thereby be illuminated equally (i.e.,nominally equal intensities of output visible light) by the circuit 30regardless of the collective length of the traces 62 that are couplingthe LEDs 38, 40 to the power source 42. In certain circuitconfigurations, circuit design requires the application of “SheetResistivity” (ohms per square) calculations to create matchingresistance levels in balancing luminosity between themutually-illuminated LEDs 38, 40. As an example, if a circuit isinteracting with a device such as a LED, a two (2) volt forward voltageand rated at 20 mA and powered in a circuit with a nine (9) voltbattery, the circuit must provide a performance of no more than 350 ohmsas provided by the thickness and width of the conductive material in thetraces 62 from a printing application.

As best shown in FIG. 4, a dielectric pattern 64 may be deposited overone or more regions of the conductive ink pattern 58 to isolate selectedtraces 62 from later deposited conductive ink patterns. The dielectricpattern 64 may be comprised of a plurality of dielectric regions 66defined using a conventional printing technique, such as theaforementioned screen print, flexo, gravure, photo-pattern, padprinting, and jet printing to deposit an acrylic or other suitablematerial on the surface 51 of blank 50. The dielectric regions 66 may beconfigured to cover sections of the traces 62 of conductive ink pattern58 so that additional conductive ink traces may be applied in a crossingpattern without undesired shorting to the conductive ink pattern 58. Theinsulating cross-over points providing for circuit-over-circuitconfigurations, and may permit the use of one or more switches, such asswitches 32-37, in a portion or portions of a circuit. In an alternativeembodiment of the invention, the dielectric regions 66 may be defined byapplying tape, a decal, or other suitable dielectric film to the surface51.

FIG. 5 illustrates a conductive ink pattern 68 that includes a pluralityof traces 70 and plurality of contact pads 72. The contact pads 72 maybe defined on the tabs 56 so that when the blank 50 is formed into a boxand the tabs 56 are folded along their respective fold lines 52, thecontact pads 72 of tabs 56 are aligned with corresponding gaps 63 toform the double-pole switches 32-37 of circuit 30. The tabs 56, traces62, 70, and contact pads 65, 72 are thereby configured so that each ofthe double-pole switches 32-37 may be closed by pressing a correspondingtab 56 into contact with a respective set of contact pads 65. Pressingthe selected tab 56 into contact with the respective contact pads 65 maycause the contact pads 72 of the selected tab 56 to bridge therespective gaps 63. A set of contact pads 65 comprising one of thedouble-pole switches 32-37 may thereby be electrically coupled by thecontact pads 72 to close the selected double-pole switch 32-37.

FIG. 6 illustrates a dielectric pattern 80, which may be deposited oversections of the conductive ink patterns 58, 68 to define a protectivelayer over regions of the traces 62, 70. The dielectric pattern 80 maybe comprised of a plurality of dielectric regions 82 defined in asimilar manner as describe with respect to dielectric pattern 64. Thedielectric regions 82 may be configured to cover sections of theconductive ink patterns 58, 68 while leaving contact pads 65, 72 exposedto allow operation of the circuit 30, and to facilitate coupling ofadditional circuit components, such as the LEDs 38, 40 and power source42 to the circuit 30.

FIG. 7 is a top view of the surface 51 of blank 50 before the blank 50is formed into the product package, and includes the conductive inkpatterns 58, 68 and the dielectric patterns 64, 80. The illustratedblank 50 is configured so that the tabs 56 are arranged into two rows84, 86 of tabs 56. The blank 50 may be further configured so that whenthe blank 50 is formed into the product package, row 84 of tabs 56aligns with two rows 88, 90 of contact pads 65, and row 86 of tabs 56aligns with two rows 92, 94 of contact pads 65. In response to pressureon one of the tabs 56, the cut lines 54 defining edges of the tab 56 maygive way, allowing the tab 56 to pivot on a hinge formed by the foldline 52 connecting the tab 56 to the blank 50. As tab 56 pivots, eachcontact pad 72 of tab 56 may contact one pad 65 in each of rows 90 and92, or rows 94 and 96 of contact pads 65, which are separated by the gap63. Two sets of opposing contact pads 65 in opposing rows (e.g., rows 88and 90, or rows 92 and 94) may thereby be electrically coupled throughthe contact pads 72 of the tab 56. Each tab 56 may thereby engage acorresponding set of contacts 65 to provide one of the double-poleswitches 32-37 of circuit 30.

Through the printing of conductive ink patterns 58, 68 and/or thedielectric patterns 64, 80, circuits may be created of non-connected,connected, and circuit-over-circuit configurations. The conductive inkpattern 58 and the dielectric pattern 64 may be comprised ofnon-metallic materials. The development of printing techniques and theuse of conductive non-metallic material facilitates the successfulcreation of the circuit 30 on either side of the folding cartonmaterial, which may be coated or uncoated, as well as crossing throughfolding or scoring lines for box or carton erection/set up. Inparticular, the printing techniques and the use of conductivenon-metallic material in the embodiments disclosed herein promote theprinting of the circuit 30 on the uncoated backside of uncoatedpaperboard, which is porous.

Referring now to FIG. 8 a cross-sectional view of a portion of circuit30 is depicted showing a plurality of layers including the lowerconductive trace 62, the dielectric region 66 isolating the lowerconductive trace 62 from the upper conductive trace 70, and the topdielectric region 82, which forms an over-layer or “rub layer” thatprotects the lower layers. The dielectric region 66 may be comprised ofa plurality of vertically stacked layers, including barrier layers 93,95, and a plurality of insulating layers 97-99. The barrier layers 93,95 may be deposited as a water-based ink containing cationic polymerparticles to form a barrier between the trace 62 and subsequentlydeposited layers. The barrier layers 93, 95 may reduce unwantedinteractions between the traces 62, 70 and insulating layers 97-99, aswell as fill voids in the underlying layers to provide a smooth surfacefor receiving subsequently deposited layers. The barrier layers 93, 95may thereby provide improved adhesion and ink holdout as compared todielectric regions 66 lacking the barrier layers 93, 95. The insulatinglayers 97-99 may be formed by depositing a suitable insulating ink, sucha ceramic ink including alumina and/or barium titanate (BaTiO₃). In aspecific embodiment of the invention, three insulating layers aredeposited using barium titanate ink at a rate of about 60 Billion CubicMicrons per square centimeter (BCM/cm²) using a gravure, silk screen, orother suitable process. The resulting ink layers may be air dried, orenergy cured using heat and/or ultraviolet light.

Referring now to FIGS. 9-11, an alternative embodiment of the circuit 30is depicted as being implemented on a blank 100 of packaging material.The blank may include fold lines 52 and cut lines 54 configured so thatblank 100 may be formed into a box in a similar manner as describedabove with respect to blank 50. FIG. 9 illustrates a conductive inkpattern 102 deposited on a surface 104 of blank 100. The surface 104 ofblank 100 may correspond to an interior surface of the product package.The conductive ink pattern 102 may be comprised of a plurality of traces106 printed on the surface 104. The traces 106 may be configured to haveinterlocking features that define a winding gap 108 between exposedsections of selected traces 106 that comprise contact pads 110 ofdouble-pole switches 32-37. The gap 108 is marked by repeated turnsalong its length.

FIGS. 10 and 11 present detailed views of two exemplary embodiments ofthe contact pads 110, which include a plurality of interlockingprojections 112. The projections 112 may be configured so that theyextend outward from a respective base line 114 toward an adjacent trace106, which has projections 112 similarly extending from the respectivebaseline 114 in an opposing direction. The projections 112 of theadjacent traces 106 may thereby form the interlocking projections 112that define the winding gap 108 between the contact pads 110 of opposingtraces 106 and thereby comprise a switch.

The projections 112 may be configured to define the gap 108 as includinga plurality of interconnected linear segments, as shown in FIG. 10. Thegap 108 may have a width defined by a distance separating opposingprojections 112, and a length defined by the distance required totraverse from one end 109 of the gap 108 to another end 111 of the gap108. By defining the gap 108 to have a winding shape, the length of thegap 108 may be increased as compared to gaps having a parallelconfiguration of opposing contact pads 65, such as gap 63. The gaps 108shown in FIGS. 9 and 10 are generally depicted as being defined by aplurality of straight segments joined at right angles. Alternatively,the projections 112 may be configured to define a plurality of straightgap segments joined at angles other than right angles. The projections112 may also be configured to define one or more curved segments such asshown in FIG. 11. Hence, a person having ordinary skill in the art wouldunderstand that embodiments of the invention are not limited to theexemplary configurations of the gap 108 shown in FIGS. 10 and 11. Thisperson would further understand that other shapes may be used to providethe interlocking features that define the winding gap 108. Thus,embodiments of the invention may include gaps 108 defined usingprojections 112 having numerous shapes that increase the length of thegap 108. The configuration of the gap 108 is therefore not limited tothe exemplary embodiments shown and described herein. In any case, thegaps 108 formed by contact pads 110 having interlocking projections 112may provide an increased length across which the contact pads 110 may becoupled as compared to gaps between contact pads lacking theinterlocking feature.

Similarly as described above with respect to FIG. 5, the contact pads 72may be defined on the tabs 56 so that, when the blank 100 is formed intoa box and the tabs 56 are folded along their respective fold lines 52,the contact pads 72 of tabs 56 are aligned with corresponding gaps 108to form the double-pole switches 32-37 of circuit 30. The contact pads72 may be defined by the same process used to define the traces 106.

Referring now to FIG. 12, the dielectric pattern 64 may be depositedover one or more regions of the conductive ink pattern 102 to isolateselected traces 106 from later deposited conductive ink patterns asdescribed above with respect to FIG. 4. The dielectric regions 66 may beconfigured to cover sections of the traces 106 of conductive ink pattern102 so that additional conductive ink traces may be applied in acrossing pattern without undesired shorting to the conductive inkpattern 102.

FIG. 13 illustrates a conductive ink pattern 116 that includes aplurality of traces 118 and the plurality of contact pads 72. Thecontact pads 72 may thereby include an additional conductive layerdeposited during the process that defines the traces 118. The tabs 56,traces 106, 118, and contact pads 110 are thereby configured so thateach of the double-pole switches 32-37 may be closed by pressing acorresponding tab 56 into contact with respective contact pads 110.Pressing the selected tab 56 into contact with the respective contactpads 110 may cause the contact pads 72 of the selected tab 56 to bridgethe respective gap 108. A set of contact pads 110 comprising one of thedouble-pole switches 32-37 may thereby be electrically coupled by thecontact pads 72 to close the selected double-pole switch 32-37.

FIG. 14 illustrates a dielectric pattern 120, which may be depositedover sections of the conductive ink patterns 102, 116 to define aprotective over-layer over regions of the traces 106, 118. Thedielectric pattern 120 may be comprised of a single dielectric layer, ora plurality of dielectric layers defined in a similar manner as describeabove with respect to dielectric pattern 80. The dielectric regions 122may be configured to cover sections of the conductive ink patterns 102,116 while leaving the contact pads 72, 110 exposed to allow operation ofthe circuit 30. The dielectric pattern 120 may also be configured toleave regions of the traces 106 exposed to facilitate coupling ofadditional circuit components such as the LEDs 38, 40 and power source42 to the circuit 30.

FIG. 15 is a top view of the surface 104 of blank 100 before the blank100 is formed into the product package, and includes the conductive inkpatterns 102, 116 and the dielectric patterns 64, 120. The blank 100 maybe configured so that the surface 104 of blank 100 faces the interior ofthe assembled product package. Similarly to the blank 50, the blank 100is configured so that the tabs 56 are arranged into two rows 124, 126 oftabs 56. The blank 100 may be further configured so that when the blank100 is formed into the product package, row 124 of tabs 56 aligns with arow 128 of contact pads 110, and row 126 of tabs 56 aligns with a row130 of contact pads 110. In response to pressure on one of the tabs 56,the cut lines 54 defining edges of the tab 56 may yield, therebyallowing the tab 56 to pivot on a hinge formed by the fold line 52connecting the tab 56 to the blank 100. As tab 56 pivots, each contactpad 72 of tab 56 may contact a set of contact pads 110 of row 128, orcontact pads 110 of row 130, thereby bridging the respective gaps 108.Two sets of opposing projections 112 of the respective contact pads 110may thereby be electrically coupled through the contact pads 72 of thetab 56. Each tab 56 may thereby engage a set of corresponding contactpads 110 to provide one of the double-pole switches 32-37 of circuit 30.

FIGS. 16 and 17 illustrate a side view of an exemplary embodiment of theproduct package 200 showing a side 202 of the product package 200 thatincludes the row of tabs 56 corresponding to switches 35-37 of circuit30. The product package 200 may include the battery compartment 204formed from the battery compartment pattern 67 of blank 50, 100. Thebattery compartment 204 may include a chock 206 formed by pressing on asection 208 of a corner 210 of product package 200 so that the section208 extends into the battery compartment 204. The chock 206 may beconfigured to provide pressure or tension on a battery 212, therebyurging terminals (not shown) of battery 212 into contact with contacts65 a, 65 b. The tabs 56 may include indicia such as images 214-216and/or text 220-222 identifying each tab as being associated with one ofpaper (214, 220), rock (215, 221), or scissors (216, 222). In FIG. 16,the tabs 56 are shown in a position that is essentially coplanar withthe side 202 of product package 200. In FIG. 17, the tabs 56 are shownpressed inward so that they extend into the interior of the productpackage 200.

FIG. 18 illustrates a perspective view of a product package 230consistent with an embodiment of the invention. The product packageincludes one side 232 having the openings 57 configured to accept LEDs,and another side 238 having tabs 56. Similarly to the product package200 in FIGS. 16 and 17, the product package 230 includes a batterycompartment 240 and battery 242.

Referring now to FIG. 19 an exemplary image 244 that may be printed orotherwise applied to side 232 of product package 230 is illustrated.Image 244 may be associated with the rock-paper-scissors game electricalcircuit 30 described in detail above. To this end, each opening 57 mayinclude one of the LEDs 38, 40, which are configured to illuminate inresponse to a player activating a tab 56 corresponding to the switch32-37 for a winning selection of rock, paper, or scissors. The LED 38,40 may thereby indicate that the player identified by one of arrows 248,250 is the winner for a particular round of rock-paper-scissors.

Referring now to FIGS. 20 and 21, an alternative embodiment of theinvention including a circuit 254 comprising a switch 255, a powersource 256, a resistor 257 and one or more LEDs 258, 259 is presented.The circuit 254 may be realized as a conductive ink pattern 260deposited on a surface 262 of a blank 264 (which is similar to blank50), which may correspond to an interior surface of a product package.The conductive ink pattern 262 may be comprised of a plurality of traces266 printed on the surface 262. The traces 266 may be configured so thatcontact pads 268 define a winding gap 270 between exposed sections ofselected traces 266 that comprise a portion of the switch 255. Portionsof the traces 266 crossing fold lines 52 may be configured with anincreased width to provide improved robustness in those areas. The blank264 may also include a tab 272 having a contact pad 274 that providesanother portion of the switch 255, and contact pads 276-281 configuredto couple the conductive ink pattern 262 to external components of thecircuit 254, such as a power source 256 and LEDs 258, 259. For example,contacts 276 and 277 may be configured to engage terminals of a battery.The resistor 257 of circuit 254 may be provided by the resistance of thetraces 266. The value of the resistor 257 may be defined by adjustingthe width, length, and thickness of the traces 266 as described abovewith respect to circuit 30.

Referring now to FIG. 22, a dielectric pattern 290 may be deposited oversections of the conductive ink pattern 260 to define a protectiveover-layer over regions of the traces 266. The dielectric pattern 290may be comprised of a plurality of dielectric regions 292 defined in asimilar manner as describe with respect to dielectric pattern 80. Thedielectric regions 292 may be configured to cover sections of theconductive ink pattern 260 while leaving contact pads 268, 274, 276-281exposed to allow operation of the circuit 254, and to facilitatecoupling of additional circuit components, such as the LEDs 258, 259 andpower source 256.

FIG. 23 is a top view of the surface 262 of blank 264 before the blank264 is formed into the product package, and includes the conductive inkpattern 260 and the dielectric pattern 290. Similarly to blanks 50, 100,blank 264 may be configured so that when the blank 264 is formed intothe product package, the surface 262 of blank 264 faces the interior ofthe package, and the tab 272 aligns with the contact pads 268. Inresponse to pressure on the tab 272, the cut lines 54 defining the edgesof the tab 272 may give way, allowing the tab 272 to pivot on a hingeformed by the fold line 52 connecting the tab 272 to the blank 264. Asthe tab 272 pivots, the contact pad 274 may come into contact withcontact pads 268, thereby bridging the respective gap 270. The opposingcontact pads 268 may thereby be electrically coupled through the contactpad 274 of the tab 272 to close the switch 255 of circuit 254.

FIG. 24 presents an exemplary image 294 that may be printed or otherwiseapplied to an exterior side of a product package formed from the blank264. The image 294 may include a feature 296 (e.g., eyes) aligned withthe openings 57 so that the product package is configured to attractattention to the feature 296 in response to a user activating the tab272. To this end, each opening 57 may include one of the LEDs 258, 259,which are configured to illuminate in response to a user activating thetab 272 corresponding to the switch 255. The LEDs 258, 259 may beenergized one at a time or multiple illuminations to create specialeffects. End uses that utilize switched illumination may include, butare not limited to, annunciation of a game winner, a response to achallenge (e.g., a question), or adding special effects to a graphicdesign, such as “glowing eyes” on the graphic design of a face. Inanother embodiment, one of the LEDs 258, 259 may be omitted such that asingle LED is illuminated when the tab 272 is activated.

Referring now to FIG. 25, a circuit 300 for a game according to analternative embodiment of the invention may include a power source 302,a resistor 304, a plurality of LED's 306-309, and a plurality ofswitches 314-327. The circuit 300 may be configured so that the switches314-327 selectively couple one or more of the LED's 306-309 to the powersource 302 through the resistor 304 in response to activation by a user.Activation of the switches 314-327 may thereby illuminate one or moreLED's in a predetermined manner. The circuit 300 may further beconfigured to provide an indication of a game result based on the user'sactivation of a selected switch 314-327.

Referring now to FIG. 26, the circuit 300 may be implemented on a blank330 in a similar manner as described above with respect to blanks 50,100, and 264. To this end, a conductive ink pattern 332 may be depositedon a surface 334 of blank 330. The surface 334 of blank 330 maycorrespond to an exterior surface of a product package. The conductiveink pattern 332 may be comprised of a plurality of traces 336 printed onthe surface 334. The traces 336 may be configured to define a gap 338(illustrated in this exemplary embodiment as a winding gap) betweenexposed sections of selected traces 336 to define contact pads 340 ofswitches 314-327. Fold lines 52 and cut lines 54 may be configured toallow the blank 330 to be formed into a product package. The fold lines52 and cut lines 54 may also define a portion 341 of the blank 330configured to form a compartment for receiving the power source 302,which may be a battery (not shown). The compartment may include variousfeatures, e.g., terminals and tabs, for mating with the batteryterminals.

The blank 330 may also include a section 342 defined by one or more cutlines 54. The section 342 may include a contact pad 344, and may beconfigured to be punched out of the product package by the user andassembled into a game stylus. The game stylus may be used to activate aselected switch by pressing the contact pad 344 against the contact pads340 comprising one of the switches 314-327 so that the contact pad 344of the stylus bridges the gap 338 separating the selected contact pads340. The user may thereby selectively activate one of the switches314-327. The stylus acts as a switch device by closing certain circuitpoints, thus illuminating LED's, or powering additional add-on devices.

The blank 330 may also include a section 346 having a plurality ofcontact pads 348-352 electrically coupled through one or more traces354. The section 346 may also be defined by one or more cut lines 54.The section 346 may be in a portion of the blank 330 that is separatefrom the portion used to form the product package, and may be removedprior to forming the product package for inclusion inside the productpackage as a toy or prize. As best shown in FIG. 27A, the section 346may also include fold lines 52 configured so that when the section 346is removed from the product package and folded along the fold lines, thesection 346 provides a game piece 357 suitable for use with atouch-sensitive device, such as a tablet computer or a smart phonehaving a touch screen. To this end, the section 346 of blank 330 may beconfigured so that the fold lines 52 define a bottom portion 356including contact pads 349-351 and side portions 358, 360 includingcontact pads 348 and 352, respectively. Each of the contact pads 348-352may be electrically coupled to the other contact pads 348-352 by thetraces 354.

When folded along the fold lines 52, the side portions 358, 360 may forma gripping portion 362 of the game piece 357 that extends from thebottom portion 356 so that the contact pads 349-351 of bottom portion356 are on an outer surface of the game piece 357. One or more of thetraces 354 may be located along the length of the fold lines 52 toprovide robust coupling (i.e., coupling that is resistant to damagecaused by folding) between the traces 356 on the bottom portion 356 ofgame piece 357 and the traces 356 on the side portions 358, 360 of gamepiece 357. The game piece 357 may be further configured so that thecontact pads 346, 352 of side portions 358, 360 face outward. The gamepiece 357 may thereby be configured so that when the user grips thegripping portion 362 of game piece 357, the user's fingers are incontact with contact pads 346, 352. The user may thereby be electricallycoupled to the contact pads 349-351 on the bottom portion 356 of gamepiece 357 so that the touch screen may sense a change in electricalloading of areas of the touch screen that come into contact with thecontact pads 349-351.

The contact pads 349-351 may be configured to form a unique footprintthat is recognized by an application running on the touch sensitivedevice, such as a game running on a tablet computer. Generally, gamescan be purchased or downloaded for free directly onto a touch sensitivedevice, such as a mobile computing device, from an online applicationstore, commonly known as an “app store” or “app market”. The use of gamepieces with touch sensitive devices is described in detail in U.S.Application Publication No 2012/0007808, entitled “GAME PIECES FOR USEWITH TOUCH SCREEN DEVICES AND RELATED METHODS”, the disclosure of whichis incorporated herein by reference in its entirety.

The number, size, shape, and positions of the contact pads 349-351 ofgame piece 357 may be varied from one product package to another so thatmultiple such different structurally-created game pieces may be definedthat are each individually recognizable by the application. Inoperation, the user may grip the gripping portion 362 of game piece 357,and press the bottom portion 356 against the touch screen. In response,the application may sense a change in capacitance, impedance, or loadingin regions of the touch screen that are in contact with the contact pads349-351. The application may then provide a response to the user basedon the configuration of the contact pads 349-351. For example, theapplication may display a particular image or cartoon character based onthe sensed configuration of the contact pads 349-351, or may take theuser to a specific portion of a game.

FIGS. 27B and 27C present an exemplary embodiment of the invention inwhich the game piece 357 includes an image of a car 363. This exemplaryembodiment of the game piece 357 may be used, for example, in a gameinvolving a car moving along a track displayed on a touch sensitivedevice 355 (e.g., a capacitance touch screen). In use, the user mayplace the game piece 357 between their thumb and index finger as shownin FIG. 27C. The game piece 357 may then be placed in contact with thetouch screen, which may determine the type of game piece 357 based onthe size, shape, position, and number of contact pads 349-351 on thebottom portion 356 of the game piece 357. In this way, the applicationmay be made to respond differently to different game pieces 357.Different game pieces 357 could be provided in the product containerover a period of time, thereby providing an incentive to purchase thesame product multiple times so as to collect each variation of the gamepiece 357.

With reference to FIGS. 27D, 27E in which like reference numerals referto like features in FIGS. 27A-C, the contact pads 349-351 of game piece357 may embossed so that each includes a respective contact surface 349a-351 a that is raised relative to the background defined by the topsurface 330 a of the section 346 of the blank 330. The configuration ofthe contact pads 349-351 may provide a relatively high relief avoidinappropriate contact (signal noise) to the screen of the touchsensitive device 355 with the connecting circuit runs. The reliefprovided by the embossing increase the signal-to-noise (S/N) ratio byelevating or raising the traces 354 away from the surface of the screenof the touch sensitive device 355, when the game piece 357 is in use, sotraces 354 do not interrupt the contact surfaces 349 a-351 a themselvesand/or contact the surface of the screen of the touch sensitive device355.

Each of the contact pads 349-351 includes a surface 349 c-351 c that isa plane parallel to the plane of the surface 330 a of the blank 330 andan inclined connecting surface 349 b-351 b. The surfaces 349 a-351 a and349 b-351 b of the contact pads 349-251 reflect the contour of thebosses formed in the underlying and supporting material of the blank330. For example, the surfaces 349 a, 349 b reproduce the contour of thesurfaces 347 a, 347 b of a boss 347 impressed by an embossing die in theblank 330 at the location of the contact pad 349. The embossing dieincludes a protruding feature that applies pressure to the board 330 atthe location of the boss 347. The board 300 plastically deforms to formthe boss 347 when pressure is applied by the embossing die. Only aportion of the contact pad 349 is embossed (i.e., displaced from theplane of the board 330 by the boss 347) such that, for example, theconductive material of the contact pad 349 is present on each of thesurfaces 347 a, 347 b, and 330 a, as well as on surfaces 349 a-351 a.

Characteristics of the boss 347, such as the included angle, θ, of thesurface 347 b relative to a bottom surface 330 b of the blank 330, theheight of the surface 347 a relative to the top surface 330 a of theblank 330, dimensions or area of the surface 347 a (e.g., diameter ifthe surfaces 347 a is round), and the relative size of the contact pad349 to the surface 347 a, may be selected to avoid fracturing thecontinuity of the circuit by cracking the conductive material of thecontact pad 349. In one embodiment, the surface 347 b may becharacterized by an included angle, θ, of 30° and the surface 347 a maybe flat or planar.

In one embodiment, the height of the top surface 347 a at the boss 347relative to the top surface 330 a is less than or equal to about 80% ofthe thickness, t, of the blank 330. Limiting the height of the topsurface 347 a (i.e., the depth of the boss 347) to this extent mayreduce the risk of fracturing the conductive material comprising thecontact pad 347. In another embodiment, the height of the top surface347 a relative to surface 330 a is less than or equal to the thickness,t, of the blank 330. Limiting the level of the relief to this extent mayreduce the risk of fracturing the board comprising the blank 330 inaddition to fracturing the conductive material comprising the contactpad 347. In yet another embodiment, the height of the top surface 347 aat the boss 347 relative to the top surface 330 a is less than or equalto about 80% of the thickness, t, of the blank 330 and greater than orequal to about 45% of the thickness, t, of the blank 330. Limiting thelower limit on the height of the top surface 347 a may provide athreshold for preventing the surface 347 c and the traces 354 fromcontacting the surface of the screen of the touch sensitive device 355.

The contact surfaces 350 a and 351 a are formed by bosses similar oridentical to boss 347 and, in each instance, each of the contact pads350, 351 is only partially embossed similar to contact pad 349. Theselection of the relative size of the contact pads 349-351 to thedimensions of their bosses may be used to account for inaccuracies infeature registration during the printing and embossing processes. As thesize of the contact pads 349-351 increases, the level of embossing canbe increased. Nearby score or fold lines 52 may be debossed into thesection 346 of the blank 330 due to their proximity to the contact pads349-351.

Referring now to FIG. 28, a dielectric pattern 364 comprising one ormore dielectric regions 366 deposited over one or more regions of theconductive ink pattern 332 may be used to isolate selected traces 336from later deposited conductive ink patterns in a similar fashion asdescribed above with respect to FIG. 4. The dielectric regions 366 maybe configured to cover sections of the traces 336 of conductive inkpattern 332 so that additional conductive ink traces may be applied in acrossing pattern without undesired shorting to the conductive inkpattern 332.

FIG. 29 illustrates a conductive ink pattern 368 that includes aplurality of traces 370 as well as the contact pad 344 of section 342,the plurality of contact pads 348-352 and traces 354 of section 346. Thecontact pads 344, 348-352 and traces 354 may thereby include anadditional conductive layer deposited during the process that definesthe conductive ink pattern 368. The traces 336, 370 and contact pads340, 344 may be configured so that each of the switches 314-327 may beselectively closed by pressing a conductive member, such as the contactpad 344 of section 342, into contact with a respective set of contactpads 340. Pressing the conductive member into contact with the contactpads 340 of a switch 314-327 may cause the contact pad 344 to bridge therespective gap 338. A set of contact pads 340 comprising one of theswitches 314-327 may thereby be electrically coupled by the contact pad344 to close the selected switch 314-327.

FIG. 30 illustrates a dielectric pattern 380, which may be depositedover sections of the conductive ink patterns 332, 368 to define aprotective over-layer over regions of the traces 336, 354, 370. Thedielectric pattern 380 may be comprised of a plurality of dielectricregions 382 defined in a similar manner as described with respect todielectric pattern 80. The dielectric regions 382 may be configured tocover sections of the conductive ink patterns 336, 368 while leavingcontact pads 340, 344, 348-352 exposed to allow operation of the circuit300, and to facilitate coupling of additional circuit components, suchas the LEDs 306-309 and power source 302. FIG. 31 provides a top view ofthe blank 330 before the blank 330 is formed into the product package,and includes the conductive ink patterns 336, 368 and the dielectricpatterns 364, 380.

FIG. 32 is a top view of the blank 330 after an exterior printingprocess. The resulting printed exterior surface includes an exemplarygame board printed over the circuit 300. The printed game board mayinclude openings (i.e., areas in which ink is not deposited) over theLED's 306-309 and contact pads 340 corresponding to the switches314-327. The game may include a path 384, a plurality of questions386-390, and instructions 392 on how to play the game. A plurality ofswitches (e.g., two) may be associated with each question. For example,switches 326 and 327 may be associated with question 386 (e.g.,“2+2+?”), with activation of switch 326 indicating one answer (e.g.,“1”), and activation of switch 327 indicating another answer (e.g.,“4”). In response to activating switch 326, LED 306 may illuminate,indicating that the user should turn left to continue up the path 384 inone direction. Similarly, in response to activating switch 327, LED 309may illuminate, indicating that the user should proceed up the path 384by turning right. In the illustrated exemplary embodiment, providing asufficient number of correct answers may lead the user to switch 317. Inresponse to activating switch 317, LED 307 may be illuminated indicatingthat the user has won the game. In contrast, incorrect answers may leadthe user to one of switches 314-316, activation of which may illuminateLED 308 indicating that the user should go back and try again. FIG. 33presents a detailed perspective view of a user playing the game byactivating switch 318 using the stylus to answer question 389, whichwould illuminate LED 306 and indicate that the user should proceed upthe path to the left.

Referring now to FIGS. 34 and 35, a blank 400 including an exemplarygame is depicted in accordance with an alternative embodiment of theinvention. The game may include a plurality of switches 402-406 and aplurality of LED's 410, 412 configured so that one LED of the pluralityof LED's 410, 412 illuminates in response to activation of one of theswitches 402-406. In the illustrated game, a printed ink circuit (notshown) may be configured so that activation of one of the switches402-406 causes LED 410 to be illuminated to indicate the user hasselected the correct answer (e.g., the correct location of a pot ofgold). The remaining switches 402-406 may be configured so thatactivation causes LED 412 to be illuminated to indicate that the userhas selected an incorrect answer (e.g., an incorrect location for thepot of gold). As best shown in FIG. 35, the user may activate a switch402-406 by pressing the contact pad 344 of the game stylus against thecontact pads of the switch in question. Games may thereby be configuredso that the user is required to select from multiple (e.g., more thantwo) choices or answers.

The circuits of the various embodiments of the invention may be printeddirectly on the package and, as a consequence, is not laminated orinserted. In one embodiment, the circuit may be printed on the backsideof the package, which is the side opposite to the frontside that istypically displayed on a product shelf. The circuit may be comprised ofmaterials that conform to CONEG regulations for landfill that areintended to reduce the sum concentration levels ofincidentally-introduced heavy metals, such as lead, mercury, cadmium,and hexavalent chromium, present in package or packaging components. Thecircuit may be a multi-level construction formed by overprinting thediscrete functional layers over one another. The circuit may becomprised dielectric (insulating) layers between adjacent conductivelayers of the circuit. The circuit may be comprised of alternatinglayers of chemical formulations to achieve dielectric (insulating)effectiveness and qualities. The package may include a batterycompartment, which may be accessible to a consumer from the exterior ofthe package for inserting a battery (e.g., a nine-volt battery) tofunctionally energize the circuit for operation. The package may includea plurality of integrated switch gates printed directly on the package,which are printed directly on the backside of the package in oneembodiment.

The circuit may be printed by a rotogravure print process, whichinvolves engraving an image of a level of the circuit pattern onto animage carrier, such as a cylinder, and using a rotary printing press toprint the circuit. Cylinder engravings are known as an abnormalconfiguration for direct print in packaging applications. A differentengraving configuration may be used for each circuit level printed withthe rotogravure print process. The engravings may include cross-hatched(i.e., intersecting) channels for carrying ink. This is in contrast toconventional intaglio printing, which includes isolated incisions intothe surface of the image carrier.

The circuit design may incorporate a specific line width and ink filmdeposits sufficient to cause a light emitting diode to emit light of agiven brightness without the utilization of an in-line resistor. Theon-package printed circuit may be operational within itself (i.e.,self-contained) in that no external input is required to, for example,play the game embodied in the circuit or to otherwise utilize thepackage.

The circuit may be printed from roll form to sheet. The package may bedie cut and/or scored with scoring (i.e., score lines) going through oracross the multiple circuits without rendering the circuits inoperative.The package may be first printed on the backside of a paperboardsubstrate, and then inverted and re-printed on the coated/top side ofthe substrate.

The package is multi-use in that not only is the actual productprotected, but a secondary use is achieved in providing additionalconsumer value, such as a functional game or an enhanced visualpresence, for amusement and/or education. Because of the addition of thecircuit, the package may be offered to consumers as an incentive to buya particular foodstuff contained inside the package, such as breakfastcereal. The package may be offered as an in-store or point-of-sale prizethat is immediately received by the customer with the purchase of thefoodstuff, and with no apparent increase in the price of the foodstuff.Moreover, because the amusing/educational features are part of thepackage, the package may continue to circulate after the product hasbeen consumed so that persons other than the original purchaser may beexposed to product marketing included on the package.

The integrity of the printed circuit may be maintained when printed oneither the backside (porous interior) of the selected substrate or thetop side of the selected substrate (which may be less porous than thebackside), and flexed over structural score lines. Circuits may be bentat 90 degrees or more crossing over score lines singularly or multipletimes in “X”, “Y” and “Z” coordinate directions, and the bending may beachieved without loss of conductivity.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof. Moreover, references herein to termssuch as “vertical”, “horizontal”, etc. are made by way of example, andnot by way of limitation, to establish an absolute frame of reference.

It will be understood that when an element is described as being“connected” or “coupled” to or with another element, it can be directlyconnected or coupled to the other element or, instead, one or moreintervening elements may be present. In contrast, when an element isdescribed as being “directly connected” or “directly coupled” to anotherelement, there are no intervening elements present. When an element isdescribed as being “indirectly connected” or “indirectly coupled” toanother element, there is at least one intervening element present.

As used herein, the term “in response to” means “in reaction to” and/or“after” a first event. Thus, a second event occurring “in response to” afirst event may occur immediately after the first event, or may includea time lag that occurs between the first event and the second event. Inaddition, the second event may be caused by the first event, or maymerely occur after the first event without any causal connection.

While the invention has been illustrated by the description of one ormore embodiments thereof, and while the embodiments have been describedin considerable detail, they are not intended to restrict or in any waylimit the scope of the appended claims to such detail. Additionaladvantages and modifications will readily appear to those skilled in theart. The invention in its broader aspects is therefore not limited tothe specific details, representative apparatus and methods andillustrative examples shown and described. Accordingly, departures maybe made from such details without departing from the scope or spirit ofApplicant's general inventive concept.

What is claimed is:
 1. A product package comprising: a paperboard blankincluding a first surface, the paperboard blank being configured todefine the product package; and a first conductive ink pattern printedon the first surface of the paperboard blank, the first conductive inkpattern defining at least part of an electrical circuit integrated withthe product package.
 2. The product package of claim 1 wherein thepaperboard blank is configured so that the first surface forms aninterior surface or an exterior surface of the product package.
 3. Theproduct package of claim 1 further comprising: a dielectric patternapplied to the first surface of the paperboard blank; and a secondconductive ink pattern printed on the first surface of the paperboardblank, wherein the dielectric pattern electrically isolates a portion ofthe first conductive ink pattern from a portion of the second conductiveink pattern.
 4. The product package of claim 1 further comprising: anelectronic component coupled to the conductive ink pattern.
 5. Theproduct package of claim 1 wherein the first ink pattern includes afirst contact pad, a second contact pad separated by a gap from thefirst contact pad, and a third contact pad configured to selectivelycouple the first and second contact pads in response to being pressedinto contact with the first and second contact pads.
 6. The productpackage of claim 5 wherein the paperboard blank includes a cut line anda fold line configured to define a tab, the tab including the thirdcontact pad and being located so that the third contact pad is pressedinto contact with the first and second contact pads in response to thetab being folded along the fold line.
 7. The product package of claim 5wherein gap has a length, the first contact pad has a width and includesa first projection, the second contact pad has a width and includes asecond projection, and the projections are configured to define the gapso that the length of the gap exceeds the width of the first contact padand the width of the second contact pad.
 8. The product package of claim7 wherein the first projection is one of a first plurality ofprojections, the second projection is one of a second plurality ofprojections, and the first and second pluralities of projections areconfigured to define the gap so that the gap has a windingcharacteristic.
 9. The product package of claim 1 wherein the paperboardblank includes a plurality of cut lines and a plurality of fold linesconfigured to define a battery compartment, the battery compartmentincluding a chock defined by a section of the paperboard blank definedby two non-intersecting cut lines and three non-intersecting fold lines.10. The product package of claim 9 wherein the fold lines defining thechock are intersected by the cut lines defining the chock.
 11. Theproduct package of claim 1 wherein the electrical circuit is printed ona section of the paperboard blank defined by one or more cut lines sothat the section is removable from the paperboard blank, the conductiveink pattern includes a first set of one or more contact pads, and thefirst set of contact pads include a shape, a number, or an arrangementthat is recognizable by a touch sensitive device.
 12. The productpackage of claim 11 wherein the section of paperboard blank isconfigured to be formed into a game piece.
 13. The product package ofclaim 12 wherein the electrical circuit includes a second set of one ormore contact pads configured to electrically couple the first set of oneor more contact pads to a user holding the game piece.
 14. The productpackage of claim 12 wherein the game piece is configured to be used withan application executing on the touch sensitive device and visible on ascreen of the touch sensitive device.
 15. The product package of claim11 wherein the paperboard blank includes a boss at the location of eachcontact pad, and a portion of each contact pad is raised by the boss todefine a contact surface.
 16. The product package of claim 1 wherein thepaperboard blank includes a score line, the printed circuit includes atrace crossing the score line and having a width-to-thickness aspectratio, wherein the width-to-thickness aspect ratio is selected so that aconductive ink comprising the first conductive ink pattern does notfracture maintained when flexed by bending of the paperboard blank atthe score line.
 17. A method of making a product package including anintegrated electrical circuit, the method comprising: printing aconductive pattern on a first surface of a paperboard blank, the firstconductive ink pattern defining at least part of an electrical circuitintegrated with the product package.
 18. The method of claim 17 furthercomprising: applying a dielectric pattern applied to the first surfaceof the paperboard blank; and printing a second conductive ink pattern onthe first surface of the paperboard blank, wherein the dielectricpattern electrically isolates a portion of the first conductive inkpattern from a portion of the second conductive ink pattern.
 19. Themethod of claim 17 further comprising: coupling an electronic componentto the conductive ink pattern.
 20. The method of claim 17 wherein theconductive ink pattern includes one or more contact pads, and thecontact pads include a shape, a number, or an arrangement that isrecognizable by a touch sensitive device.